Lead wires control cost, performance of electronic devicesCAPP, J; GOERSS, G. A; LABUN, L. C et al.Electri.onics. 1984, Vol 30, Num 9, pp 60-62, issn 0745-4309Article

Wire and cable fundamentalsElectri.onics. 1983, Vol 29, Num 13, pp 46-81, issn 0745-4309Article

Wire and cable glossaryElectri.onics. 1985, Vol 31, Num 13, pp 45-56, issn 0745-4309Article

Modeling of ice accretion on wiresMAKKONEN, L.Journal of climate and applied meteorology. 1984, Vol 23, Num 6, pp 929-939, issn 0733-3021Article

PVC compoundingRICHARDSON, Colin.Wire industry. 2002, Vol 69, Num 826, issn 0043-6011, p. 570Article

Laser wire stripper effectively removes «ML» polyimide for repeated solderabilityMILLER, R. T.Electri.onics. 1985, Vol 31, Num 2, pp 54-55, issn 0745-4309Article

Development of the cable industry in the Commonwealth of Independent StatesPESHKOV, I. B.Russian electrical engineering. 1996, Vol 67, Num 6, pp 11-16, issn 1068-3712Article

Protection contre l'incendie: il est grand temps d'isoler les fils et câbles avec des matériaux sans halogène = Fire protection: it is high time to isolate the wires and cables with materials without halogeneTravaux communaux. 1987, Vol 33, Num 287, pp 117-118, issn 0496-1293Article

Le tréfilage des fils, fins et très fins en aluminium allié = Thin and very thin aluminium alloys wire drawingKREMPP, O.ELEC 85. 1985, pp 49-57Conference Paper

Câblerie, quelques chiffres : Câblerie = Wire industry , some datasGAILLIEZ, E.Plastiques modernes et élastomères. 1997, Vol 49, Num 6, issn 0032-1303, p. 48Article

Self-assembled wires and channelsVAN NOSTRUM, C. F.Advanced materials (Weinheim). 1996, Vol 8, Num 12, pp 1027-1030, issn 0935-9648Article

The effect of melt compressibility on a high-speed wire-coating processTAI-SHUNG CHUNG.Polymer engineering and science. 1986, Vol 26, Num 6, pp 410-414, issn 0032-3888Article

Transient current capacities of bond wires in hybrid microcircuitsCOXON, M; KERSHNER, C; MCELIGOT, D. M et al.IEEE transactions on components, hybrids, and manufacturing technology. 1986, Vol 9, Num 3, pp 279-285, issn 0148-6411Article

On the parasitic capacitances of multilevel skewed metallization linesTAYLOR, C. D; ELKHOURI, G. N; WADE, T. E et al.I.E.E.E. transactions on electron devices. 1986, Vol 33, Num 1, pp 41-46, issn 0018-9383Article

One-dimensional GaAs wires fabricated by focused ion beam implantationHIRAMOTO, T; HIRAKAWA, K; IYE, Y et al.Applied physics letters. 1987, Vol 51, Num 20, pp 1620-1622, issn 0003-6951Article

THE CHEMISTRY OF INKSKARTZMAN T.1982; WIRE J. INT.; USA; DA. 1982; VOL. 15; NO 5; PP. 50-53; 2 P.Article

WIRE BONDING PROCESS CHARACTERIZATION BY X-RAY DIFFRACTION TOPOGRAPHYYASUAMI S; MIKAMI H; FUJITSU T et al.1982; J. ELECTROCHEM. SOC.; ISSN 0013-4651; USA; DA. 1982; VOL. 129; NO 4; PP. 846-850; BIBL. 5 REF.Article

COIL WINDING UPDATE: FINE WIRE TENSION DEVICESLEE DS.1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 5; PP. 37-38Article

SPECIAL CONSIDERATIONS FOR SOLDERING BOBBIN ASSEMBLIESKEAR FW.1980; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1980; VOL. 26; NO 11; PP. 43-45Article

ACCEPTANCE OF "REEL" AS A STANDARD TERM.KELLER M.1975; WIRE WORLD INTERNATION.; GERM.; DA. 1975; VOL. 17; NO 1; PP. 31-33; ABS. FR. ITAL. ESPArticle

MARKING INKS: A MATTER OF NECESSITYGEMELLI DJ.1982; WIRE J. INT.; USA; DA. 1982; VOL. 15; NO 5; PP. 46-50; 4 P.Article

METHODS AND EQUIPMENT FOR WIRE STRIPPING AND CRIMP TERMINATIONSCURTIS AF.1980; INSULAT. CIRCUITS; USA; DA. 1980; VOL. 26; NO 6; PP. 27-30Article

SNOW ACCRETION ON ELECTRIC WIRES AND ITS PREVENTION.WAKAHAMA G; KUROIWA D; GOTO K et al.1977; J. GLACIOL.; G.B.; DA. 1977; VOL. 19; NO 81; PP. 479-487; ABS. FR. ALLEM.; BIBL. 4 REF.; (SYMP. APPL. GLACIOL.; CAMBRIDGE, ENGL.; 1976)Conference Paper

HYDROSTATIC PROFILE OF FERROFLUID AROUND A VERTICAL CURRENT-CARRYING WIRE.KRUEGER DA; JONES TB.1974; PHYS. OF FLUIDS; U.S.A.; DA. 1974; VOL. 17; NO 10; PP. 1831-1833; BIBL. 6 REF.Article

WERE MARKING: A CHANGING TECHNOLOGYGRAY WT; FALSON R.1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 5; PP. 55-57Article